Composites of glass-ceramic to metal seals and method of making the same

ABSTRACT

A composite comprises a first metal or alloy component having a thin refractory oxide layer on a first surface thereof. A second metal or alloy component has a second thin refractory oxide on the first surface thereof. Means are provided having a closely matched coefficient of thermal expansion to the first and second metal or alloy components for bonding the first and second thin refractory oxide layers and for electrically insulating the first component from the second component whereby thermal stress between the metal or alloy components and the bonding means is substantially eliminated.

While the invention is subject to a wide range of applications, it isespecially suited for use in printed circuit board applications and willbe particularly described in that connection.

The printed circuit industry produces most printed circuits by adheringone or more layers of copper foil to organic materials such as glassfiber reinforced epoxy, phenolic laminated paper, polyester films,polyimide films, etc. Although widely used, these structures havecertain deficiencies. Firstly, their maximum operating temperature isrestricted by the maximum temperature tolerance of the organic substrateused. Secondly, a substantial mismatch usually exists between thecoefficient of thermal expansion of the organic substrate and that ofthe copper foil, that of the solder compositions normally used to attachcomponents to the circuitry and that of the components themselves. Thecoefficient of thermal expansion of the organic materials is normallysubstantially greater than that of the copper foil, the solder or thecomponents being attached to the circuit. This mismatch results insubstantial "thermal stresses" whenever the finished product isthermally cycled. These stresses create a variety of failure modes, suchas tensile failure of the copper foil, failure of the solder attachmentof components to the circuit and tensile failure of the componentsthemselves.

To alleviate some of the problems associated with thermal stress, theindustry uses two distinct types of metal core boards. One is an epoxyor other organic insulation over the metal core (either steel oraluminum), and the other is porcelain enameled steel.

The most popular is the metal core-organic type. Typically, the metalcore, such as 0.050" thick aluminum, is drilled with oversized holes. Asthe core is coated with epoxy, the holes are filled with the epoxy.Copper foil is then bonded to one or both surfaces of the core. Theholes are redrilled to a desired size and a liner of the epoxy (or otherorganic) is left in each hole. The finished metal core board compares toand may be processed as a standard plastic board. This may includeelectroless deposition of copper in the holes to provide current pathsfrom top to bottom, etc. Better heat dissipation is provided by themetal core board as compared to the glass fiber reinforced epoxy typeboards with rather poor thermal conductivity.

The second type of board, porcelain enameled steel, is considered eithera metal core board or a metal clad board depending on the terminology.First, porcelain enamel (essentially a glassy material) is applied to asheet of steel. A circuit pattern is screen printed on the surface ofthe porcelain enamel with one of the thick film "conductive inks" andthe board is refired to create a continuous pattern of metallicconductive elements. Through-holes cannot be used due to problems withshort circuiting and, therefore, multi-layer boards are not manufacturedin this manner. The porcelain (glass) is rather thick and its thermalconductivity is relatively poor; in fact, it is even poorer than thethermal conductivity of plastics used in plastic boards or as a coatingin metal core boards described above. It follows that the heatdissipation characteristics of the porcelain board are poor.

Conductive ink technology usually requires multiple applications of theconductive ink to build a conductor pattern which is thick enough tocarry a desired electric current. The multiple screening and firingoperations used in applying the conductive ink tend to be relativelycomplicated and expensive.

Presently, there is an increase in the circuit density of printedcircuit boards. This creates a need for narrower and more closely spaced"wires" or lines on the printed circuit board. The minimum line widthgenerated by the state of the art conductive ink technology is limitedby the printing process for applying the conductive ink. Also, the finalconductive ink (generally either copper- or silver-) porcelain-steelproduct frequently has problems relating to the metallized pattern. Thepattern may have a substantially different (higher) coefficient ofthermal expansion than the steel substrate. This causes a substantialshear force at the circuit-porcelain interface and substantial risk offailure during thermal cycling.

Many of the above-mentioned considerations regarding clad metal aredescribed in a paper entitled "Clad Metal Circuit Board Substrates forDirect Mounting of Ceramic Chip Carriers" by Dance and Wallace andpresented at the First Annual Conference of the InternationalElectronics Packaging Society, Cleveland, Ohio, 1981. Also, an articleentitled "Use of Metal Core Substrates for Leadless Chip CarrierInterconnection" by Lassen in Electronic Packaging and Production, March1981, pages 98-104, discusses the latest technology in metal coresubstrates.

Presently, copper foil is adhered to an organic printed circuitsubstrate by electrodeposition of "coral copper" to the foil surface.The result is a rough surface with re-entrance cavities to receive thesurface layer of the organic substrate and/or the organic adhesive toform a "locked" mechanical bond. Since the surface layer is a conductivemetal structure (copper) embedded in the organic material, considerablecare must be exercised to remove any residual coral copper treatmentfrom the spaces between the final printed circuit lines. This avoidsunwanted current passing between lines, bridging of solder across thespaces between lines, etc. In principal, removal of residual coralcopper treatment from areas requires additional etching beyond thatrequired to remove the base foil itself. This excessive etching leads toadditional undercutting and partial destruction of the circuit pattern.Thus, the manufacturer of conventional copper foil-organic circuitboards must strike a balance between enough etching to reliably removethe coral copper treatment while minimizing excessive etching to preventundercutting of the circuit pattern.

The increased complexity of circuitry for interconnecting variousdevices mounted upon a printed circuit board often requires that bothsurfaces of the board contain conductive patterns. Some of theinterconnections are provided by the circuit pattern on the obverse faceof the board (the surface to which the components are mounted), whileother interconnections are provided upon the reverse side of the board.The interconnection between the obverse and reverse sides of the boardmay be provided by solder filled throughholes. Conventional two sidedcopper foil-organic boards of this general configuration are widelyused. However, in state of the art porcelain enameled steel substrateboards, two sided boards are not practical since the solid andcontinuous steel substrate creates a continuous path for electricalconduction from one through hole to another.

In certain applications, the circuit requirements include a double sidedor multi-layered board in which thermal exposure or other factorsprevent the use of a copper foil-organic board. An alternative is ametal circuit pattern on both sides of a suitable ceramic,non-conductive substrate with interconnection between the two circuitsby conductive through-holes. This technique is used on specializedprinted circuit boards and upon substrates for hybrid packages.

As integrated circuits become larger (more individual functions on asingle silicon chip), and there is a corresponding increase in thenumber of leads for interconnection, the principal means of integratedcircuit interconnection, the dual-in-line (DIP) package becomesimpractical. A DIP includes a lead frame with the leads emerging fromthe package and formed into "pins". As its name indicates, the DIPpackage has two rows of pins, one on either side of the package. Thepins are inserted and soldered into holes in a printed circuit board.Characteristically, the pins are spaced apart on 0.100" centers. Arelatively simple device requiring a 20 lead package, 10 on a side, willbe approximately 1" long. A 40 lead DIP package is about 2" long and a64 lead DIP package, about the largest now made, is approximately 3.2"long. For reasons relating to geometry, as the packages become longerwith more pins, they become wider. Typically, the width of the completedpackage is approximately one-third its length. For both mechanical andelectronic reasons, DIP packages with more than 64 leads are consideredimpractical to manufacture. However, large-scale integrated circuitsoften require more interconnections than provided by DIP packages. Evenwith smaller integrated circuits, the circuits are spaced together onthe printed circuit board as closely as possible. Obviously, the packagesize limits the closeness of the spacing. Therefore, the semiconductorindustry has a growing interest in "chip carriers".

Chip carriers deal with the problems of large-scale circuits requiringmore interconnections than provided by a DIP package as well asreduction of package size for intermediate sized integrated circuits toincrease component density on the printed circuit board. The term chipcarrier, in its broadest sense, relates to packages, both ceramic andplastic. The configuration of a chip carrier may be essentially squareand leads emerge from within the package on all four sides. Furthermore,typical center-to-center spacing of leads on a chip carrier is 0.050".Thus, a 64 lead device having a "footprint" of roughly 3.25"×1.1" in aDIP package has a "footprint" of approximately 0.8"×0.8" in a chipcarrier package. More importantly, the area covered by the chip carrierwould be approximately 18% of that covered by the DIP package. At thistime, chip carrier packages with 128 and more leads are being produced.

The principal constraint in establishing 0.100" as the normal spacingbetween leads on the DIP package is the insertion of the lead pins intoholes on the printed circuit board. Allowing for the hole, a pad areaaround the hole for solder adhesion and spacing between the holes toelectrically isolate them from each other, it becomes difficult to crowdthem much closer together.

Typically, the coefficient of thermal expansion of the DIP package isdifferent from that of the printed circuit board. The extent to whichboard and package dimensions change with varying temperature can beaccommodated by deflection of the leads, i.e. between the printedcircuit board and the package. Effectively, the leads become springmembers which accommodate the differences in coefficient of expansion.

State of the art chip carriers having 0.050" leads are not normallymounted by insertion of the leads into holes in the printed circuitboards. Instead, most chip carriers use a surface mounting technique inwhich the lead forms a pad mounted flush to the printed circuit boardand is soldered in place. The metallized pads on the exterior surface ofthe chip package are integral with the package and expand and contractwith the package. There is no accommodation for deflection of leads dueto changes in board and package dimensions, as in the case of DIPpackages, during thermal cycling. As a result, the solder bond betweenthe pad and the board is subjected to substantial stresses. The stressesincrease as the total package size becomes larger and/or the board'soperation is in an expanded temperature range. Repeated stressing of thesolder bond leads to fatigue failure.

As with DIP packages, chip carrier packages may use a plastic package ormay require a hermetic package. With the DIP package, essentially thesame external configuration is employed for a hermetic (CeramicDual-In-Line Package) or a plastic package. In both configurations, theflexible leads accommodate for differential thermal expansion.

The "standard" glass cloth reinforced epoxy board material has acoefficient of thermal expansion of 15.8×10⁻⁶ /°C. Ceramic chip carriersusually made from an aluminum oxide ceramic have a coefficient ofthermal expansion of 6.4×10⁻⁶ /°C. If thermal conductivity isparticularly important, they made be made from beryllium oxide alsohaving a coefficient of thermal expansion of 6.4×10-6/°C. In eitherevent, there is a substantial mismatch in coefficient of thermalexpansion between the board and the chip carrier. Therefore, substantialstresses are imposed on the solder bond when subjected to significantthermal cycling.

One solution has been to surface mount the chip carrier to a metallizedpattern on an aluminum oxide ceramic substrate. The substrate has thesame coefficient of thermal expansion as the chip carrier. Pins may bebrazed to the alumina substrate and plugged into holes in the printedcircuit board. Although this sort of configuration avoids problemsassociated with mismatch in coefficient of thermal expansion, it alsohas the effect of sacrificing much of the space saving advantage of thechip carrier.

A description of the latest technology with respect to chip carriers ispresented in an article entitled "Chip-Carriers, Pin-Grid Arrays Changethe PC-Board Landscape" by Jerry Lyman, Electronics, Dec. 29, 1981,pages 65-75. Another article entitled "Chip Carriers: Coming Force inPackaging" by Erickson, in Electronic Packaging and Production, March1981, pages 64-80 discusses the construction and other detailsconcerning chip carriers.

U.S. Pat. No. 3,546,363 to Pryor et al. discloses a composite metalproduct for use as a seal to glasses and ceramics which has propertiesof a low coefficient of expansion, approximating that of the appropriateglasses and ceramics, good thermal conductivity, and fine grain size inthe annealed condition.

U.S. Pat. Nos. 3,546,363; 3,618,203; 3,676,292; 3,726,987; 3,826,627;3,826,629; 3,837,895; 3,852,148; and 4,149,910 disclose glass or ceramicto metal composites or seals wherein the glass or ceramic is bonded to abase alloy having a thin film of refractory oxide on its surface.

U.S. patent application Ser. No. 261,330, filed May 7, 1981 nowabandoned to Butt et al. discloses for example, "a process forthermosonically bonding leadwires to leadframes having a thin refractoryoxide layer".

U.S. patent application No. 341,392, filed Jan. 19, 1982 to Buttdiscloses for example, "a highly reliable metal casing which is sealedand bonded using an adhesive".

It is a problem underlying the present invention to provide a chipcarrier and a chip carrier mounted on a circuit board which canaccommodate substantial thermal cycling.

It is an advantage of the present invention to provide a chip carrierand a chip carrier mounted on a circuit board which obviate one or moreof the limitations and disadvantages of the described priorarrangements.

It is a further advantage of the present invention to provide a chipcarrier and chip carrier mounted on a circuit board which substantiallyreduce the formation of stresses between the chip carrier and thecircuit board due to thermal cycling.

It is a still further advantage of the present invention to provide achip carrier and chip carrier mounted on a circuit board which arerelatively inexpensive to manufacture.

It is a further advantage of the present invention to provide a chipcarrier and chip carrier mounted on a circuit board having improved heatdissipation.

Accordingly, there has been provided an chip carrier and a process ofassembling an chip carrier. The carrier used for mounting a chipcomprises a copper or copper base alloy component having a thinrefractory oxide layer on a surface thereof. The surface and the oxidelayer have an indentation formed therein for receiving the chip. Ametallic circuit pattern for electrical connection to the chip is bondedto the oxide layer and insulated from the copper or copper base alloy bythe refractory oxide layer. A seal is provided for enclosing the chip tothe indentation. Another embodiment of the invention includes a circuitboard structure comprising a circuit board device having a firstcoefficient of thermal expansion. A between each of the thin refractoryoxide layers of two metal base alloy components to provide rigidity tothe multi-layer composite.

The invention and further developments of the invention are nowelucidated by means of preferred embodiments shown in the drawings:

FIG. 1 is a cross section of a prior art printed circuit board;

FIG. 2 is a cross section of a metal core prior art printed circuitboard;

FIG. 3 is a cross section of a printed circuit board having a glasscomponent bonded between the refractory oxide coating of two copperalloys in accordance with the present invention;

FIG. 4 is a printed circuit board having high thermal conductivitysubstrates bonded to copper alloy components;

FIG. 5 is a cross-sectional view of a printed circuit board with a fusedrefractory oxide layer between two substrates;

FIG. 6 is a printed circuit board having circuits on opposite surfacesand interconnections therebetween;

FIG. 7 is a cross-sectional view of a printed circuit board havingcircuits on opposite surfaces and a metal grid therebetween;

FIG. 8 is a top view of a metal grid used for reinforcement of a printedcircuit board;

FIG. 9 is a view through 9--9 of FIG. 8;

FIG. 10 is a side view of a multi-layer printed circuit board inaccordance with the present invention;

FIG. 11 is a side view of a leadless chip carrier in accordance with thepresent invention;

FIG. 12 is a view through 11--11 of FIG. 10; and

FIG. 13 is a side view of a leadless chip carrier mounted upon a printedcircuit board in accordance with the present invention.

As shown in FIG. 1, prior art printed circuits 10 are produced byadhering one or more layers of copper foil 12 to organic material 14such as glass fiber reinforced epoxy, phenolic laminated paper, etc.These structures have several deficiencies including restricted maximumoperating temperature due to the organic substrate and substantialmismatch between the coefficient of thermal expansion of the organicsubstrate and that of the copper foil, the solder compositions to attachcomponents to the circuitry and the components themselves. Substantialthermal stresses, resulting from the mismatch, create failure modes suchas tensile failure of the copper foil, failure of the solder attachmentof components to the circuit and tensile failure of the componentsthemselves.

There is some use of metal core boards 16 found in FIG. 2. Typically,these include a metal core 18, a copper foil 22 and an epoxy insulatinglayer 20 bonded to both layer 20 and foil 22. This type of boardprovides better heat dissipation than the normal glass fiber reinforcedepoxy boards but still has the restricted maximum operating temperaturerelated to the organic substrate. Also, substantial mismatch between thecoefficient of thermal expansion of the organic substrate and the copperfoil causes the types of problems associated with conventional printedcircuits as shown in FIG. 1.

The present invention overcomes these problems by providing a compositeor printed circuit board 24 as shown in FIG. 3. The composite mayinclude a first metal or metal base alloy component 26 having a thinrefractory oxide layer 28 on at least a first surface 30 thereof and asecond thin refractory oxide layer 34 on at least surface 36 of a metalor metal base alloy component 32. A glass component 38 is bonded to thefirst and second thin refractory oxide layers 28 and 34 to insulate thecomponent 26 from the second component 32.

The preferred alloy for use in the embodiments of the present inventionis a copper base alloy containing from 2 to 12% aluminum and the balancecopper. Preferably, the alloy contains from 2 to 10% aluminum, 0.001 to3% silicon, and if desired, a grain refining element selected from thegroup consisting of iron up to 4.5%, chromium up to 1%, zirconium up to0.5%, cobalt up to 1% and mixtures of these grain refining elements andthe balance copper. In particular, CDA alloy C6381 containing 2.5 to3.1% aluminum, 1.5 to 2.1% silicon, and the balance copper is useful asa substrate for this invention. Impurities may be present which do notprevent bonding in a desired environment.

The alloys useful with this invention and, especially alloy C6381 asdescribed in U.S. Pat. Nos. 3,341,369 and 3,475,227 to Caule et al.which disclose copper base alloys and processes for preparing them, havea refractory oxide layer formed to one or more of its surfaces. Theoxide layer may include complex oxides formed with elements such asalumina, silica, tin, iron chromia, zinc, and manganese. Mostpreferably, the refractory oxide layer is substantially aluminum oxide(Al₂ O₃). The formation of the refractory oxide to the substrate may beaccomplished in any desired manner. For example, a copper base alloysuch as alloy C6381 may be preoxidized in gases having an extremely lowoxygen content. The C6381 may be placed in a container with 4% hydrogen,96% nitrogen and a trace of oxygen released from a trace of water mixedin the gas. This gas may be heated to a temperature of between about330° C. and about 820° C. Depending on the temperature and amount oftime the alloy is left in the heated gas, a refractory oxide layer of adesired thickness forms on the surface of the alloy.

The present invention is not restricted to applications of alloy C6381but includes the broad field of metal or alloys which have the abilityto form continuous refractory oxide layers on their surface. Severalexamples of other metal alloys such as nickel base and iron base alloysare disclosed in U.S. Pat. Nos. 3,698,964, 3,730,779 and 3,810,754.Alloy C6381 is particularly suitable for this invention because it is acommercial alloy which forms such films when heated. The copper orcopper base alloy component may also include composite metals in whichthe refractory oxide forming metal or alloy is clad upon another metalby any conventional technique. This other metal may be another copperalloy or any other metal whose bulk properties are desired for aspecific application.

The present invention uses any suitable glass or ceramic component 38,such as cited in the patents above, preferably with a coefficient ofthermal expansion which closely matches the metal components. The glassis bonded to the thin refractory oxide layers 28 and 34 and functions toadhere the metal components together and electrically insulate them fromeach other. Since the glass and the copper alloy substrates preferablyhave the same or closely matched coefficients of thermal expansion,thermal stresses in the system may be essentially eliminated and theproblems associated with thermal stress in the finished productalleviated.

Table I lists various exemplary glasses and ceramics which are adaptedfor use in accordance with this invention.

                  TABLE I                                                         ______________________________________                                                            Coefficient of Thermal                                    Glass or Ceramic Type                                                                             Expansion, in./in./°C.                             ______________________________________                                        Ferro Corp..sup.1 No. RN-3066-H                                                                   167 × 10.sup.-7                                     Ferro Corp..sup.1 No. RN-3066-S                                                                   160 × 10.sup.-7                                     ______________________________________                                         .sup.1 Proprietary composition manufactured by Ferro Corporation,             Cleveland, Ohio.                                                         

Referring again to the embodiment as illustrated in FIG. 3, a foil layer32 is bonded to a thicker supportive layer 26 by means of glass 38. Thefoil 32 may be subsequentially treated with a "resist" pattern andetched to produce a printed circuit. The result is a wrought copperalloy circuit pattern bonded to and insulated from a wrought copperalloy supportive substrate 26 by a layer of glass 38 which serves asboth an adhesive and an insulating material. This configuration has anumber of advantages over the prior technique of printing circuitry uponthe surface of porcelain with conductive ink. Firstly, in the priorconductive ink technology, multiple layers of the conductive ink areapplied to provide an adequate conductive pattern for the requiredelectric current. However, the circuit foil 32 may be of any desiredthickness and replaces the multiple screening and firing operations by asingle firing operation and a single etching operation. Secondly, recentincreases in circuit density of printed circuit boards create a need fornarrower and more closely spaced printed "wires" or lines. The priorconductive ink technology is limited to the minimum line width generatedby the printing process. The present invention, however, etches copperfoil and provides narrow lines and spaces as in conventional etchedcopper foil, organic substrate circuits. Thirdly, the metallized patternformed on the conductive ink-porcelain-steel circuit board has asubstantially higher coefficient of thermal expansion than the steelsubstrate. Thermal cycling develops substantial shear forces at thecircuit-porcelain interface creating substantial risk of failure. Theembodiment of FIG. 3 substantially eliminates these shear forces becausethe coefficient of thermal expansion of the circuit foil and the metalsubstrate may be substantially the same.

Where greater conductivity than that inherent in the metal or alloysproducing bondable alumina and silica films is desired, a compositecopper alloy foil incorporating a higher conductivity layer, as shown inFIG. 4, may replace the solid alloy 32 as in the previous embodiment.

The embodiment of FIG. 4 includes bondable copper alloy substrate 40 andcircuit foil 46 having refractory oxide layers 41 and 43, respectively.A glass or ceramic 44 is bonded between the oxide layer 43 on circuitfoil 46 and the oxide layer 41 on the copper base alloy 40. Substrate 40is bonded, as a composite, to a copper or high conductivity copper alloythicker component 42. The latter provides for superior thermaldissipation from the board as compared to both conventional copperfoil-organic boards and porcelain on steel boards. Also, foil 46 may bebonded as a composite to a copper or high conductivity copper alloycomponent 47 for superior electrical or thermal conductivity. It is alsowithin the scope of the present invention to provide only one of thecomponents 42 or 47 as required. It is also within the scope of thepresent invention to modify any of the described embodiments by bondingthe component, as a composite, to a metal layer having desired physicalproperties.

The embodiment as shown in FIG. 5 provides copper alloy substrates 48and 49 each forming a refractory oxide layer. These refractory layersare fused together into layer 50 and dispense with the provision ofglass. The unified refractory oxide layer 50 both adheres the metalsubstrates 48 and 49 and insulates them from each other. It is withinthe scope of the invention to substitute the glass in the embodiments ofthe present invention with fused refractory layers as desired.

The complexity of the circuitry for interconnecting the various devicesmounted upon a printed circuit board often requires that both surfacesof the board contain conductive patterns. Details of prior art two sidedcircuit boards are described in the background of the invention.

A two sided circuit board configuration 55, as shown in FIG. 6, has tworelatively thick layers of copper base alloy components 50 and 52, eachhaving a thin refractory oxide layer 51 and 53, respectively, on atleast one surface. The components are bonded together and insulated fromone another by a glass or ceramic 54 which is fused to the oxide layers51 and 53. A circuit pattern is formed on each of the components 50 and52 by a conventional technique. The thickness of each metal component isestablished in accordance with the desired stiffness of the finishedboard. The circuit patterns on each side of the board 55 must becarefully designed to provide reasonable stiffness and to avoid planesof weakness. Such planes might develop if an area of considerable sizewithout any circuitry on one side of the board coincides with a similararea on the reverse side of the bond. Through-holes 56 may be providedin the circuit board by any conventional technique such as drilling orpunching. The through-holes may be formed into a conductive path by anysuitable means such as electroless deposition of copper on their walls.If desired, the through-holes can then be filled with a conductivematerial such as solder.

Another embodiment of a two sided metal glass printed circuit board 57,as shown in FIG. 7, includes two copper alloy substrates 58 and 60, eachhaving a thin refractory oxide layer 62 and 64, respectively, bonded onat least one surface. A glass component 65 is fused to the layers 62 and64. A grid 66, preferably metal, is bonded in the glass 65 and insulatedfrom the alloy substrates 58 and 60. The recesses 68 of the grid may befilled with glass 65 or any other suitable inorganic filler.Through-holes 69 are formed in the board as described above. The resultis a board with the same design flexibility as conventional foil-organicboards but with the advantage of substantial elimination of thermalstresses. The metal grid both stiffens the board 57 and permits aplurality of through-holes 69 to pass through openings 63 of the grid.The through-holes must not contact the metal grid to avoid shortcircuits.

The metal grid is preferably made of a copper alloy having a thinrefractory oxide layer on both surfaces. It is, however, within thescope of the present invention to use any desired material to constructthe grid. The grid may be formed with any desired configuration, and atypical one is shown in FIG. 8. A series of recesses 68 are stamped in ametal sheet 67. Subsequently, the bottom 63 of the recesses are piercedleaving a pattern of interlocking "V" bars, as shown in FIG. 8, forreinforcement.

The need for still greater circuit complexity than provided by a twosided circuit board leads to multilayer circuit boards with three ormore layers of copper foil. Using the concepts described hereinabove, amulti-layer board composed of alternate layers of copper alloy foilhaving a thin refractory oxide layer on each surface in contact with theglass insulator is described. As shown in FIG. 10, copper foilcomponents 70, 71 and 72 have their refractory oxide layers 73, 74 and75, respectively, bonded to glass 76. The foil components may each beprovided with circuitry as in the embodiments described above. Also, thecomponents may be bonded as composites to other metals with desiredphysical properties as described above. It is thought that the thickermulti-layer boards will be sufficiently rigid. Where additional rigidityis required, grid reinforcement as described and illustrated in FIG. 7may be added. Also, through-holes 77,78 and 79 between the circuits, asdescribed above, may be provided as necessary. Note that thethroughholes may be between any number of circuits.

Since the power consumption of most board mounted electronic componentsis quite modest, the heat generated during their operation is comparablysmall. However, as packaging density becomes greater, more elaboratemeans for cooling must be provided. The present invention provides forcooling of the multi-layer printed circuit boards, as shown in FIG. 10,by bonding high thermal conductivity layers of copper alloy to thecircuit foil, as in FIG. 4. This layer of copper alloy functions toconduct heat from the board. It is within the scope of the invention toprovide one or more layers of conductive material 80 within themulti-layer board. Material 80 may be a solid strip of high thermalconductivity material such as copper or copper alloy. It may bedesirable to use a copper alloy having a refractory oxide layer forimproved bonding to the glass 76. Naturally, any through-holes mayrequire insulation from the strip 80. The conductive material 80 maycomprise one or more tubular members embedded in the glass to providecoolant passages. Again, it is preferable that the copper tubing have athin refractory oxide layer on its surface to bond to the glass.

Another important aspect of the present invention resides in theprovision of a leadless ceramic chip carrier which can be directlymounted to the surface of a printed circuit board. This chip carriersubstantially eliminates excessive stressing of the solder bond to thecircuit board which generally occurs during thermal cycling of the chipcarrier-printed circuit board systems as described hereinabove.Referring to FIGS. 11 and 12, there is illustrated a leadless chipcarrier 90 wherein a copper alloy 92 with a thin refractory oxide layer93, such as Al₂ O₃, provided on one surface thereof is substituted forthe prior art alumina or beryllia ceramic. A glass 94 may be fused ontothe oxide layer as described above. It is, however, within the scope ofthe invention to use only the oxide layer. As can be seen in FIG. 11,the copper alloy 92 may be shaped with a slight indentation 96,exaggerated in the drawing to better clarify the concept. It is withinthe scope of the present invention to form the indentation in anydesired configuration. A metal foil 98, which may be formed of the samematerial as 92, having a refractory oxide layer 99, is bonded to theglass 94 or oxide layer 93 and etched in any conventional manner toprovide electrical leads 100. A chip 102 is preferably attached to theglass 94 by any conventional technique and lead wires connected betweenthe circuitry on the chip and the leads 100.

The chip may be sealed within the indentation 96 by several techniques.Preferably, the sealing device 97 may be a cover plate 104 comprising acopper or copper base alloy having a thin refractory oxide layerthereon. Glass 95 is fused onto at least the edges of the cover 97. Thisglass can be bonded to either the refractory layer 99 on the component98 or to the glass 94 as required. The result is to hermetically sealthe chip 102 in the leadless chip carrier 90. Another embodimentprovides the seal by filling the indentation 96 with an epoxy. The epoxywill bond to the leads and the glass and provide an adequate but notnecessarily hermetic seal.

Referring to FIG. 13, the leadless chip carrier 90 is affixed to atypical printed circuit board 110. This board has copper foil 112 and114 separated by glass cloth reinforced epoxy 116. A circuit is providedon the foil 112. The leadless chip carrier may be applied directly ontothe circuitry of strip 112 by solder pads 118 between the lead 100 andthe foil 112 in a conventional manner.

Alloy C6381, the preferred material of alloy components 92 and 98 of thechip carrier, has a coefficient of thermal expansion of 17.1×10⁻⁶ /°C.This is only 8.2% different from the coefficient of thermal expansion ofconventional glass cloth reinforced epoxy which is 15.8×10⁻⁶ /°C. Thisis a vast improvement over chip carriers formed of alumina ceramic whichhave a coefficient of thermal expansion of 6.4×10⁻⁶ /°C., i.e.approximately 144% greater than the thermal expansion of the aluminaceramic. The result is a significant decrease in the formation of stressbetween the solder, leads and circuit board due to thermal cycling.

As the number of individual functions incorporated upon a single siliconchip becomes larger, the amount of heat generated requiring dissipationincreases accordingly. Also, as the number of functions become greater,they are packed more closely together on the chip which furthermagnifies the problem of heat dissipation. It is a further advantage ofthe present invention that the thermal conductivity of alloy C6381 is 24Btu/ft² /ft/hr/°F. This is 131% greater than the thermal conductivity ofalumina oxide (typically used for chip carriers) which is 10.4 Btu/ft²/ft/hr/°F. Also, the thermal resistance imposed between the chip and theexterior means of heat dissipation is reduced because of the thinnersections of the tougher material such as 6381 which are able to replacethe thicker, more fragile and brittle materials such as aluminaceramics. It should be noted that in certain applications, beryllia witha thermal conductivity of 100 Btu/ft² /ft/hr/°F. is used as a substratefor better heat dissipation despite its extremely high cost.

Referring again to FIG. 11, the copper alloy component 92 with arefractory oxide layer may be clad upon copper or any high conductivityalloy 113. Assuming that the composite metal is approximately 10% alloyC6381 clad upon 90% alloy C151, the overall thermal conductivity is 196Btu/ft² /ft/hr/°F. This is 18.8% better than the thermal conductivity ofalumina and 63% better than that provided by beryllia. In addition,there is the additional advantage of a thinner chipless carrier ascompared to a thicker alumina carrier.

The surface mounted hermetic chip carrier as described above andillustrated in FIG. 12 will resolve most of the normal problemsassociated with the effect of thermal cycling on a chip carrier that issurface mounted to a conventional glass cloth reinforced epoxy printedcircuit board. However in some cases, a closer match of coefficient ofthermal expansion may be required and/or greater heat dissipationcapability may be necessary. In these cases, a metal board configurationof the types described hereinabove and illustrated in FIGS. 2-7 and 10may be substituted for the conventional printed circuit board.

In one embodiment, reduced mismatch of thermal expansion and greaterheat dissipation can be achieved by mounting a chip carrier of the typeillustrated in FIGS. 11 and 12 on a prior art printed circuit board asshown in FIG. 2 where the core is copper or a high conductivity copperalloy. An alloy may be desirable if greater strength is required thanmay be provided with pure copper. A suitable plastic insulating layer 20is appropriately bonded to the copper or copper alloy core and in turn,the printed circuit foil 22 is bonded to the insulating layer. Theplastic must be suitable for bonding with adhesives, have suitabledielectric characteristics and the ability to withstand processingtemperatures such as soldering. The thermally conductive plastics may beparticularly useful for the plastic layer. These plastics typicallycontain metal powders to improve their thermal conductivity whilemaintaining dielectric properties since the metal powders are not in acontinuous phase. Since the plastic is only thick enough to provide thenecessary dielectric properties, resistance to heat transfer from thechip carrier to the high conductivity copper or copper alloy core isminimized. It can be appreciated that the coefficient of thermalexpansion of the metal board is essentially the same as that of theglass coated chip carrier and, therefore, stresses induced by thermalcycling of the system are substantially eliminated. This configurationis limited by the temperature capability of the plastic or plastics andthe temperature resistance of the adhesives which are used inconjunction with the plastics.

To improve the maximum temperature capability of the leadless chipcarrier and printed circuit board combination, a printed circuit boardas illustrated in FIG. 3 may be used in conjunction with the leadlesschip carrier 90 shown in FIG. 11. In this configuration, the metal coreconsists of copper or a high conductivity copper alloy 26 to which isclad alloy C6381 or an alternative glass bondable copper alloy. In turn,a printed circuit foil 32 consisting of a glass bondable copper alloysuch as C6381 is bonded to the glass 38. The alloy bonded to the C6381may be selected from copper or high conductivity copper alloys so as toimprove the electrical conductivity in the circuit or to provide optimumsolderability characteristics. The system is completely inorganic andwill withstand temperatures much higher than systems with organicmaterials and further avoids various modes of degradation to whichorganic materials are susceptible.

An additive circuit may be substituted for photoetched foil 48 in FIG.5. The circuit may be generated upon a glass coating applied to therefractory oxide layer on alloy C6381 or other glass bondable alloy corematerial 49 using conventional techniques employed in generatingadditive circuits. For example, the additive circuit may be a patternprinted upon the surface of the glass with conductive ink and fired intoplace. It is also within the scope of the present invention for thealumina film which may be formed by heating the alloy to be used as thedielectric layer separating the metal core from the additive circuit.

Whereas an oxide layer has been described as being formed by separatelyheating the metal or alloy, it may be formed in any manner such asduring the process of bonding the metal or alloy to the glass, ceramicor another oxide layer.

Whereas the chip carrier has been described as leadless, it is alsowithin the scope of the present invention to substitute a chip carrierwith leads.

The patents, patent applications and publications set forth in thisapplication are intended to be incorporated by reference herein.

It is apparent that there has been provided in accordance with thisinvention a composite, a chip carrier and a system of mounting the chipcarrier with the composite which satisfies the objects, means, andadvantages set forth hereinabove. While the invention has been describedin combination with the embodiments thereof, it is evident that manyalternatives, modifications, and variations will be apparent to thoseskilled in the art in light of the foregoing description. Accordingly,it is intended to embrace all such alternatives, modifications, andvariations as fall within the spirit and broad scope of the appendedclaims.

I claim:
 1. A composite comprising:a fist metal or alloy componenthaving a first thin refractory oxide layer on at least a first surfacethereof; a second metal or alloy component having a second thinrefractory oxide layer on at least a first surface thereof; and glass orceramic means having a coefficient of thermal expansion of at least160×10⁻⁷ in/in/°C., said coefficient of thermal expansion of said glassor ceramic means being closely matched to the coefficient of thermalexpansion of said first and second metal or alloy components, said glassor ceramic means bonding said first and second thin refractory oxidelayers for substantially eliminating thermal stress within saidcomposite.
 2. A composite as in claim 1 wherein said first and secondmetal or alloy components comprise a copper or copper alloy.
 3. Acomposite as in claim 2 wherein said first and second alloy componentscomprise:2 to 12% aluminum and the balance essentially copper.
 4. Acomposite as in claim 3 wherein said first and second alloy componentscomprise:2 to 10% aluminum, 0.001 to 3% silicon and the balanceessentially copper.
 5. A composite as in claim 4 wherein said first andsecond alloy components consist essentially of:2.5 to 3.1% aluminum, 1.5to 2.1% silicon and the balance essentially copper.
 6. A composite as inclaim 2 wherein said first and second refractory oxide layers includeAl₂ O₃.
 7. A composite as in claim 2 wherein said first componentsupports and strengthens said composite, said first component furtherincluding:a first copper or copper base alloy substrate bonded to thesecond surface opposite said first surface of said first component, saidsubstrate having a higher conductivity than said first component forincreasing the conductivity of said first component.
 8. A composite asin claim 2 wherein said first metal or alloy component further has afirst thin refractory oxide layer on a second surface opposing saidfirst surface thereof, andsaid composite further comprising: at least athird copper or copper alloy component having a third thin refractoryoxide layer on at least a first surface thereof, and said glass orceramic means further bonding said first oxide layer on a second surfaceof said first component to the third oxide layer on the third componentwhereby said first and third component are electrically insulated fromeach other.
 9. A composite as in claim 8 further including:metallic gridmeans bonded in said glass or ceramic means between at least said firstand third components for stiffening said composite.
 10. A compositecomprising:a first metal or alloy component having a first thinrefractory oxide layer on at least a first surface thereof; a secondmetal or alloy component having a second thin refractory oxide layer onat least a first surface thereof; and means having a closely matchedcoefficient of thermal expansion to said first and second metal or alloycomponents bonding said first and second thin refractory oxide layersfor substantially eliminating thermal stress within said composite; saidfirst and second metal alloy components comprising a copper or copperalloy; at least a third copper or copper base alloy component havingthird and fourth thin refractory oxide layers on opposing surfaces ofsaid at least third component, means for bonding said first and thirdthin refractory oxide layers and said second and fourth refractory oxidelayers to provide rigidity to the resulting multi-layer composite; atleast two glass components, one of said glass components being bonded tosaid first and third thin refractory oxide layers and the other of saidglass components being bonded between said second and fourth thinrefractory oxide layers of said second and third components; andmetallic grid means bonded into at least one of said glass componentsfor stiffening said multi-layer composite.
 11. A composite as in claims8 or 9 wherein said copper base alloy components comprise:2 to 12%aluminum and the balance essentially first, second and third copper. 12.A composite as in claim 11 wherein said first, second and third alloycomponents further comprise:2 to 10% aluminum, 0.001 to 3% silicon andthe balance essentially copper.
 13. A method of forming a composite,comprising the steps of:providing a first metal or alloy componenthaving a first thin refractory oxide layer on at least a first surfacethereof; providing a second metal or alloy component having a secondthin refactory oxide layer on at least a first surface thereof;providing a glass or ceramic bonding component having a coefficient ofthermal expansion of at least 160×10⁻⁷ in/in/°C., said coefficient ofthermal expansion being closely matched to the coefficient of thermalexpansion of the first and second metal or alloy components; and bondingsaid first and second thin refractory oxide layers with said glass orceramic bonding component for substantially eliminating thermal stresswithin said composite.
 14. The method of claim 13 including the step ofselecting said first and second metal or alloy componets from the groupconsisting of copper or copper alloy.
 15. The method of claim 14 furtherincluding the step of bonding a first copper or copper base alloysubstrate to a second surface opposite said first surface of said firstcomponent for increasing the conductivity of said first component. 16.The method of claim 15 further including the step of bonding a secondcopper or copper base alloy substrate to a second surface opposite thefirst surface of said second component for increasing the conductivityof said second component.
 17. The method of claim 16 further includingthe step of bonding a metallic grid into said glass or ceramic componentfor stiffening said composite.
 18. A method of forming a composite,comprising the steps of:providing a first metal or alloy componenthaving a thin refractory oxide layer on at least a first surfacethereof; providing a second metal or alloy component having a secondthin refractory oxide layer on at least a first surface thereof;providing a bonding means having a closely matched coefficient ofthermal expansion with that of the first and second metal or alloycomponents; bonding said first and second thin refractory oxide layerswith said bonding means for substantially eliminating thermal stresswithin said composite; selecting said first and second metal or alloycomponents from the group consisting of copper or copper alloy; bondinga glass or ceramic component between said first and second refractoryoxide layers; bonding a first copper or copper base alloy substrate to asecond surface opposite said first surface of said first component forincreasing the conductivity of said first component; bonding a secondcopper base alloy substrate to a second surface opposite the firstsurface of said component for increasing the conductivity of saidsecond.component; and bonding a metallic grid into said glass or ceramiccomponent for stiffening said composite.